LG Micro LED Display with Megapixel HELIOS LED Processing Platform

Powerful UI/UX with Megapixel HELIOS LED Processing Platform

With the Megapixel HELIOS LED Processing Platform, LSAP now has the capability to utilize powerful UX and UI functionalities. Real-Time Mapping and Multi-User Control, Superior Color Control, Hyper-Speed Seam Correction using a game controller, and Monitoring and Diagnostics through connected diagnostics are all available.

Enhanced Uniformity with LST (LG Surface Treatment) Technology

LG MAGNIT's innovative Chip Transfer and Surface Treatment Technology enhances white uniformity and reduces color distortion from any angle, delivering true and accurate wide-angle viewing experiences. This technology ensures remarkable color uniformity, resulting in superior image quality.

Achieving True Black with Direct Chip Mounting

LG MAGNIT's advanced and precise method for direct bonding micro-sized chips onto circuit boards combined with the black coating technology, creates a stunning black expression that stands out compared to SMD-type LED displays. This makes it the ideal choice for displaying content that requires deep black color, ensuring that every image is rich, vibrant, and true to life.

Accurate Colors as Intended

By carefully selecting an LED chip which is a key factor to determine color purity, its narrowed wavelength allows LG MAGNIT to show uniform colors across the screen. Furthermore, the enhanced Gamut Transfer technology supports it to describe colors close to the original color, which is essential for places where exact color representation is demanding.

Care Less with Sturdy Design

Through several layers of coated film, LSAP can protect its LED chips from risks caused by water drops, dust, static electricity or physical impacts. It also meets the fire regulations with BS 476 Part 7 Class 1 certification. Considering that it is usually installed in public places where many people come and go, its stability is vitally important to minimize unforeseen accidents.

PHYSICAL PARAMETERS

Pixel Configuration: COB
Pixel Pitch (mm): 0.938
Module Resolution (W x H): 320 x 120
Module Dimensions (W x H, mm): 300 x 112.5
Weight per Module (kg): 0.19
No. of Modules per Cabinet (W × H): 2 × 3
Cabinet Resolution (W × H): 640 × 360
Cabinet Dimensions (W x H x D, mm): 600x337.5x44.9
Cabinet Surface Area (m²): 0.203
Weight per Cabinet (kg/unit): 7.6
Weight per Square Meter (kg/m²): 37.5
Physical Pixel Density (pixels/m²): 1,137,778
Flatness of Cabinet (mm): ±0.5
Cabinet Material: Die-casting Aluminum
Service Access: Front and Rear

OPTICAL SPECIFICATIONS

Max Brightness (After Calibration, nit): Max. 600
Color Temperature (K): 6,504K / 2,000~10,000K
Visual Viewing Angle (Horizontal): 160°
Visual Viewing Angle (Vertical): 160°
Brightness Uniformity: ≥ 95%
Color Uniformity: ±0.02Cx,Cy
Contrast Ratio: Max. 100,000:1
Processing Depth (bit): 22bit Internal processing (HDR10)

ELECTRICAL SPECIFICATIONS

Power Consumption (W/Cabinet, Max.): 68
Power Consumption (W/Cabinet, Avg.): 47
Power Consumption (W/m², Max.): 336
Heat Dissipation (BTU/h/Cabinet, Max.): 232
Heat Dissipation (BTU/h/Cabinet, Avg.): 160
Heat Dissipation (BTU/h/m², Max.): 1146
Power Supply (V): 100 to 240
Frame Rate (Hz): 23.98/24/25/29.97/30/50/59.94/60
Refresh Rate (Hz): 3,840

OPERATION SPECIFICATIONS

LED Lifetime (Half brightness): 100,000
Operating Temperature(℃): 0∘ to +40∘
Operating Humidity: 10-80%RH
IP Rating Front: IP50
IP Rating Rear: IP20

CERTIFICATION

Certification: IEC 62368-1, EMC Class A, BS476 Part7 Class2Y

ENVIRONMENT

Environment: RoHS/REACH

CONTROLLER

Controller: MVR HEIOS

SERIES

Series: LSAP